From Sunflower recipe to finished bouquet — end to end.
Four layers, one line. A recipe becomes a pick map; the pick map becomes a place-pose sequence; the sequence becomes a physical bouquet with millimeter repeatability.
One line of responsibility per layer.
ERP / BOM
Sunflower holds the versioned recipe: parent bouquet, component stems, greens, fillers, consumables. Work orders, backflush, and traceability live here.
Vision service
Fixed-mount 3D RGB-D camera captures each pick station, plans grasp poses, and re-images after grip to measure protrusion.
Motion service
Direct Python control of the cobot. Waypoint + inverse kinematics for open cells, optional full planner for cluttered ones, force-mode insertion scaled per stem.
Cobot + carousel
Universal Robots-class collaborative arm and a matte-backdrop pick carousel. Safety planes, force limits, and protective stops live on the robot controller.
Seven steps, once per stem.
The post-grasp re-image trades a few seconds per stem for grip certainty — a deliberate choice that keeps quality high on delicate varieties.
- 1Carousel indexes to the next pick bin.
- 23D capture plans a grasp pose on the target stem.
- 3Identity check confirms the stem matches the recipe.
- 4Approach, grip, and retreat under motion planning.
- 5Re-image to confirm grip and measure stem protrusion.
- 6Adjust the place offset in real time to match protrusion.
- 7Force-controlled insertion seats the stem in the bouquet.
Recipe = manufacturing BOM
The finished bouquet is the parent. Stems, greens, fillers, wraps, and consumables are the components. Versioning captures seasonal and cost changes so a recipe is reproducible across pilots, holidays, and years.
A visual layout builder emits the pick map and the ordered place-pose sequence.
Safety & compliance
Safety planes, force and speed limits, and protective stops live on the robot controller and are never bypassed. A formal cell risk assessment precedes production.
Want the full technical overview?
A PDF walkthrough of the architecture, safety envelope, and integration surface.